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Friday, November 7- NVIDIA: Jensen Huang and Bill Dally Awarded Prestigious Queen Elizabeth Prize for Engineering
- Nebius Launches Token Factory to Deliver Production AI Inference at Scale
- Hyperion Research Announces Availability of New AI in HPC ROI Study
- VAST Data Secures Commercial Partnership Deal with CoreWeave for $1.17B
- Nebius Deploys Blackwell Ultra AI Infrastructure in the UK
- Lenovo Highlights Need for Liquid-Cooled, AI-Ready Infrastructure in New Report
- Giga Computing Announces Worldwide Availability of Its NVIDIA RTX PRO Server
- BrainChip Unveils AKD1500 Edge AI Co-Processor at Embedded World North America
- NCSA Awards 38 Students Fiddler Innovation Fellowships
- ORNL, NVIDIA, HPE Advance Quantum Computing, AI and HPC for Science
- Ai2 Launches OlmoEarth: Foundation Models and Open Infrastructure to Tackle the Planet’s Biggest Problems
- RapidFire AI Launches Open Source Package to Accelerate Agentic RAG and Context Engineering Success
- Researchers Explore How Generative AI Tools Are Shaping Computer Science Education
- AWS and OpenAI Announce Multi-Year Strategic Partnership
- European Commission Launches ‘Resource for AI Science in Europe’
- SandboxAQ Launches Public Database Exposing Cryptographic Risks in Open-Source Software
- UCSD: Generative AI Can Help Athletes Avoid Injuries
- CoreWeave to Enter the US Federal Market
- Nscale and VAST Data Unite to Build Global Fabric for AI Accelerated by NVIDIA
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Contributors
Alex WoodieEditorial Director
and Contributing
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Jaime HamptonManaging Editor
Ali AzharContributing Editor
Drew JollyContributing Editor
Synopsys Collaborates with TSMC to Accelerate 3nm Innovation, Enabling Next-Gen SoC Design
MOUNTAIN VIEW, Calif., Aug. 25, 2020 — Synopsys, Inc. announced that TSMC has certified Synopsys’ digital and custom design platforms for TSMC’s 3-nanometer (nm) process technology. This certification, based on TSMC’s latest ...Full Article
AWS Announces General Availability of Amazon EBS io2 Volume
SEATTLE, Aug. 25, 2020 — Amazon Web Services, Inc., (AWS), an Amazon Company, announced the general availability of io2, the next generation Provisioned IOPS SSD volumes for Amazon Elastic ...Full Article
Ansys Achieves Certification of its Multiphysics Solutions for TSMC’s 3nm Process Technology
PITTSBURGH, Aug. 25, 2020 — Ansys achieved certification of its state-of-the-art multiphysics signoff solution for TSMC’s most advanced 3nm process technology. This enables mutual customers to satisfy key power, thermal and reliability requirements ...Full Article
QCI Appoints Former Boeing Executive, James B. Davis, to Technical Advisory Board
LEESBURG, Va., Aug. 25, 2020 — Quantum Computing Inc. has appointed former Boeing vice president and manufacturing operations expert, James B. Davis, to its technical advisory board. Davis brings to the ...Full Article
Synopsys and TSMC Accelerate 2.5D/3DIC Designs with CoWoS-S and Integrated Fan-Out Certified Design Flows
MOUNTAIN VIEW, Calif., Aug. 25, 2020 — Synopsys, Inc. announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon interposer ...Full Article
Marvell and TSMC Collaborate to Deliver Data Infrastructure Portfolio on 5nm Technology
SANTA CLARA, Calif., Aug. 25, 2020 – Marvell, provider of data infrastructure semiconductor solutions, announced an extension of their long term partnership with TSMC, a dedicated semiconductor foundry, to ...Full Article
ScaleMP Expands its vSMP MemoryONE to Support Range of NVMe SSDs
FORT LEE, N.J.–ScaleMP, provider of virtualization solutions for high-end computing, announced it is expanding its memory expansion product portfolio to offer vSMP MemoryONE software for a broad range of NVMe SSDs, ...Full Article
Intel Announces Latest Upgrades to its Intel oneAPI Rendering Toolkit at SIGGRAPH 2020
Aug. 25, 2020 — At SIGGRAPH 2020, Intel announced the latest additions to the Intel oneAPI Rendering Toolkit. Part of Intel’s oneAPI family of products, the toolkit brings premier ...Full Article
Cadence Announces Availability of UltraLink D2D PHY IP on TSMC N7, N6 and N5 Processes
SAN JOSE, Calif., Aug. 25, 2020 — Cadence Design Systems, Inc. announced the availability of its silicon-proven Cadence UltraLink D2D PHY IP on the TSMC N7 process. Test silicon on ...Full Article
Altair Joins Avicenna Alliance to Support Simulation-based Development of Medical Breakthroughs
TROY, Mich., Aug. 25, 2020 – Altair has joined the Avicenna Alliance, an international consortium committed to the use of simulation to enable faster and more efficient development of new medicine and ...Full Article