Covering Scientific & Technical AI | Monday, June 22, 2026

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Appen Teams with NVIDIA to Enable Customized AI Solutions for Enterprises

May 3rd, 2023 Comments Off on Appen Teams with NVIDIA to Enable Customized AI Solutions for Enterprises
KIRKLAND, Wash., May 3, 2023 -- Appen Limited (ASX: APX), a global leader in data for the AI Lifecycle, today announces it is collaborating with NVIDIA to combine Appen’s top-tier data services with the NVIDIA AI Enterprise platform. Through this technology, ...

ACM Announces Technical Awards Recipients

May 3rd, 2023 Comments Off on ACM Announces Technical Awards Recipients
NEW YORK, May 3, 2023 -- ACM, the Association for Computing Machinery, today announced the recipients of four prestigious technical awards. Recognizing these individuals is one way ACM educates the wider public about the science behind the technologies we ...

Tachyum Completes Porting of Software for Prodigy Tape-Out

May 3rd, 2023 Comments Off on Tachyum Completes Porting of Software for Prodigy Tape-Out
LAS VEGAS, May 3, 2023 -- Tachyum has announced its latest milestone of officially entering the final phase of testing and development for the Prodigy Universal Processor. This last stage of Quality Assurance (QA) testing of all necessary ported ...

CoolIT Systems to be Acquired by KKR

May 2nd, 2023 Comments Off on CoolIT Systems to be Acquired by KKR
CALGARY, Alberta & NEW YORK, May 2, 2023 — KKR, a leading global investment firm, and CoolIT Systems (“CoolIT” or the “Company”), a leading provider of scalable liquid cooling solutions for the world’s most demanding computing environments, today announced ...

Tenstorrent Selects Arteris IP for AI HPC and Datacenter RISC-V Chiplets

May 2nd, 2023 Comments Off on Tenstorrent Selects Arteris IP for AI HPC and Datacenter RISC-V Chiplets
CAMPBELL, Calif., May 2, 2023 — Arteris, Inc., a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced Tenstorrent has licensed Ncore and FlexNoC interconnect IP for its AI chiplet systems. The flexible network-on-chip (NoC) interconnect ...

Registration Open for Hyperion Research HPC Market Update Breakfast Briefing During ISC23

May 2nd, 2023 Comments Off on Registration Open for Hyperion Research HPC Market Update Breakfast Briefing During ISC23
ST PAUL, Minn., May 2, 2023 — Hyperion Research, the leading industry analyst and market intelligence firm for high performance computing (HPC), AI, cloud, quantum, and associated emerging markets, today announced that registration is open for their HPC Market Update ...

Data Center World’s Expo Hall to Feature Over 200 Exhibitors, May 8-11

May 2nd, 2023 Comments Off on Data Center World’s Expo Hall to Feature Over 200 Exhibitors, May 8-11
SAN FRANCISCO, May 2, 2023 -- Data Center World, a leading global conference for data center, facilities and IT infrastructure, will feature state-of-the-art data center products and services. Over 200 exhibitors will showcase the latest technologies and innovations to ...

Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox Standard

April 27th, 2023 Comments Off on Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox Standard
SAN JOSE, Calif., April 27, 2023 -- Cadence Design Systems, Inc. announced new design flows based on the Cadence Integrity 3D-IC platform to support the TSMC 3Dblox standard for 3D front-end design partitioning in complex systems. Through this latest collaboration, ...

Register Now for AnsibleFest at Red Hat Summit

April 27th, 2023 Comments Off on Register Now for AnsibleFest at Red Hat Summit
April 27, 2023 -- This year, AnsibleFest will take place at Red Hat Summit in Boston May 23-25, harnessing all that Red Hat technology has to offer in a single place. To give you even more tools to address ...

Argonne’s Self-driving Lab Accelerates Discovery Process for Materials with Multiple Applications

April 27th, 2023 Comments Off on Argonne’s Self-driving Lab Accelerates Discovery Process for Materials with Multiple Applications
April 27, 2023 — Researchers have a new scientific tool called Polybot, combining the power of artificial intelligence with robotics. Potential applications include speeding up the discovery of wearable biomedical devices, materials for better batteries and more. Today’s wearable ...
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