Covering Scientific & Technical AI | Monday, June 22, 2026

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AMD Announces Ryzen Embedded R2000 Series
June 21st, 2022 (0)
NUREMBERG, Germany, June 21, 2022 — AMD has announced the Ryzen Embedded R2000 Series, second-generation mid-range system-on-chip (SoC) processors optimized for a wide range of industrial and robotics systems, machine vision, IoT and thin-client equipment. Ryzen Embedded R2000 Series ...

Supermicro Announces Global Availability of Intelligent Edge Systems
June 21st, 2022 (0)
NUREMBERG, Germany and SAN JOSE, Calif., June 21, 2022 — Supermicro has announced the global availability of a wide range of systems for edge computing, including the recently announced SuperEdge and a range of Intel Xeon D processor-based systems, ...

RISC-V Announces First New Specifications of 2022, Adding to 16 Ratified in 2021
June 21st, 2022 (0)
NUREMBERG, Germany, June 21, 2022 — RISC-V International, the global open-design standards pioneer, announced its first four specification and extension approvals of 2022 – Efficient Trace for RISC-V (E-Trace), RISC-V Supervisor Binary Interface (SBI), RISC-V Unified Extensible Firmware Interface (UEFI) ...

AI Sweden Preps State-of-the-art Language Model
June 20th, 2022 (0)
June 20, 2022 -- If the King of Sweden wants help drafting his annual Christmas speech this year, he could ask the same AI model that’s available to his 10 million subjects. As a test, researchers prompted the model, ...

Asperitas Teams Up with Unica Datacenters for Immersion Cooling Deployments
June 16th, 2022 (0)
AMSTERDAM, The Netherlands, June 16, 2022 – Immersion cooling specialist Asperitas, has announced its partnership with datacentre infrastructure expert, Unica Datacenters for the execution of commissioning, service and maintenance of Asperitas products to provide first class customer satisfaction for their ...

OpenFive Joins Universal Chiplet Interconnect Express Consortium
June 16th, 2022 (0)
MILPITAS, Calif., June 16, 2022 — OpenFive, a leading provider of custom silicon solutions with differentiated IP, has announced that the company has joined the Universal Chiplet Interconnect Express (UCIe) Consortium as it continues to contribute to open industry ...

Cadence Design IP Portfolio in TSMC’s N5 Process Gains Broad Adoption
June 16th, 2022 (0)
SAN JOSE, Calif., June 16, 2022 — Cadence Design Systems, Inc. has announced a wide range of leading semiconductor and system customers have successfully adopted the comprehensive line-up of Cadence Design IP in TSMC’s industry-leading 5nm process technology. Designed ...

Renesas Announces Investment in Open-Source Company Arduino
June 15th, 2022 (0)
TOKYO, June 14, 2022 -- Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced an investment in Arduino’s new round of Series B funding. The partnership with Arduino enables Renesas to make its broad range of ...

MooVita Intros Latest ADAS Innovations in Its MooBox Technology, Powered by Hailo AI Chip
June 14th, 2022 (0)
Singapore & Tel Aviv, Israel, June, 14, 2022 -- MooVita Pte Ltd, a high-tech company that designs and deploys roadworthy autonomous driving solutions in urban cities worldwide, announced the newest iteration of its proprietary MooBox technology, including its latest ...

KIOXIA Introduces JEDEC XFM Removable Storage Device
June 14th, 2022 (0)
SAN JOSE, Calif., June 14, 2022 — KIOXIA America, Inc. today announced sampling of the industry’s first1 XFM DEVICE Ver.1.0-compliant removable PCIe standard attached, NVMe storage device: the XFMEXPRESS XT2. With a new form factor and connector, the XFM DEVICE Ver.1.0 standard ...
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