Archives
DDN Launches Next Generation of High Performance NVMe and Hybrid Storage
November 16th, 2021
CHATSWORTH, Calif., Nov. 16, 2021 – DDN, a global leader in artificial intelligence (AI) and multicloud data management solutions, announced the availability of its next generation of NVMe platforms, the SFA 400NVX2 and 200NVX2. These Storage Fusion Architecture systems are the ...
U of Rhode Island Partners with the Massachusetts Green HPC Center
November 16th, 2021
KINGSTON, R.I., Nov. 16, 2021 – The University of Rhode Island has become the first academic institution outside of the state of Massachusetts to join the Massachusetts Green High-Performance Computing Center. The center is a collaboration of the five ...
Kontron Partners with AI Chipmaker Hailo to Launch High-Performance Edge AI Inference Solutions
November 16th, 2021
ISMANING, Germany & TEL AVIV, Israel, Nov. 16, 2021 — Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), announced today it has forged a strategic technology partnership with leading AI (Artificial Intelligence) chipmaker Hailo to offer next generation AI edge inference ...
Cerebras Announces New SDK to Extend Breadth of Wafer-Scale Applications
November 16th, 2021
SUNNYVALE, Calif., Nov. 16, 2021 – Cerebras Systems Inc. (“Cerebras”), the pioneer in accelerating artificial intelligence (AI) compute, today announced at SC21 a new Cerebras Software Development Kit (SDK) that will enable the developer community to create new wafer-scale applications across computational fluid dynamics, ...
IBM Unveils Breakthrough 127-Qubit Quantum Processor
November 16th, 2021
ARMONK, N.Y., Nov. 16, 2021 — IBM today announced its new 127-quantum bit (qubit) ‘Eagle’ processor at the IBM Quantum Summit 2021, its annual event to showcase milestones in quantum hardware, software, and the growth of the quantum ecosystem. The ‘Eagle’ processor is ...
Ansys Multiphysics Solutions Achieve Certification for Samsung’s 3nm and 4nm Process Technologies
November 15th, 2021
Nov. 15, 2021 — Ansys achieved certification of its cutting-edge multiphysics signoff solutions for Samsung Foundry’s advanced 3nm and 4nm process technologies. This enables joint customer designs to meet critical power, thermal, and reliability standards for highly sophisticated artificial intelligence/machine learning, high-performance computing ...
Astera Labs Introduces CXL 2.0 Memory Accelerator SoC Platform
November 15th, 2021
SANTA CLARA, Calif., Nov. 15, 2021 — Astera Labs, a pioneer in connectivity solutions for intelligent systems, today announced its new Leo Memory Accelerator Platform for Compute Express Link (CXL) 1.1/2.0 interconnects to enable robust disaggregated memory pooling and expansion for processors, ...
StrongBox Data Names Andrew Hall as CEO
November 15th, 2021
PORTLAND, Ore., Nov. 15, 2021 – StrongBox Data Solutions (SBDS), a leading provider of autonomous large-scale data management and archive solutions, today announced the appointment of Andrew Hall as chief executive officer (CEO) to lead the growth and transition of the ...
Supermicro Accelerates Delivery of HPC Clusters for Total IT Solutions with a Broad Portfolio of Servers, Storage, AI Solutions, and Liquid Cooling
November 15th, 2021
SAN JOSE, Calif., Nov. 15, 2021 -- Super Micro Computer, Inc. (SMCI), a global leader in high-performance computing, storage, networking solutions, and green computing technology, is expanding its HPC market reach for a broad range of industries by innovating at the ...
Intel Marks 50th Anniversary of the Intel 4004
November 15th, 2021
Nov. 15, 2021 — Today, Intel celebrates the 50th anniversary of the Intel 4004, the world’s first commercially available microprocessor. With its launch in November 1971, the 4004 paved the path for modern microprocessor computing – the “brains” that ...