Covering Scientific & Technical AI | Saturday, June 20, 2026

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DDN Expands AI Data Platform with Support for NVIDIA Blackwell Systems
March 18th, 2025 Comments Off on DDN Expands AI Data Platform with Support for NVIDIA Blackwell Systems
CHATSWORTH, Calif., March 18, 2025 -- DDN today announced it is integrating the NVIDIA AI Data Platform reference design with DDN EXAScaler and DDN Infinia 2.0—part of the DDN AI Data Intelligence Platform — to power a new wave of ...

Ciena Global Survey Explores Networking Needs for AI Era
March 18th, 2025 Comments Off on Ciena Global Survey Explores Networking Needs for AI Era
HANOVER, Md., March 18, 2025 -- The rapid growth of AI workloads is driving a major transformation in data center network infrastructure, with global data center experts anticipating a significant increase in interconnect bandwidth needs over the next five ...

Danish Meteorological Institute Expands AI Weather Research with Gefion Supercomputing Agreement
March 18th, 2025 Comments Off on Danish Meteorological Institute Expands AI Weather Research with Gefion Supercomputing Agreement
COPENHAGEN, Denmark, March 18, 2025 -- The Danish Centre for AI Innovation A/S (DCAI) has announced a multi-year agreement with the Danish Meteorological Institute (DMI) to develop the next generation of weather models on Gefion. The agreement follows breakthrough ...

Parallel Works Expands ACTIVATE with New Virtualization Integrations to Streamline Cloud Resource Management
March 18th, 2025 Comments Off on Parallel Works Expands ACTIVATE with New Virtualization Integrations to Streamline Cloud Resource Management
CHICAGO, March 18, 2025 -- Parallel Works, provider of the ACTIVATE control plane for AI and HPC resources, today unveiled a powerful new OpenStack integration through its ACTIVATE platform, transforming how enterprise IT teams orchestrate and manage cloud resources. ACTIVATE ...

XConn Unveils Apollo 2 Hybrid Switch with CXL 3.1 and PCIe 6.2 Integration
March 17th, 2025 Comments Off on XConn Unveils Apollo 2 Hybrid Switch with CXL 3.1 and PCIe 6.2 Integration
SAN JOSE, Calif., March 17, 2025 -- XConn Technologies today unveiled its Apollo 2 hybrid switch that integrates both Compute Express Link (CXL) 3.1 and Peripheral Component Interconnect Express (PCIe) Gen 6.2 interconnect technology on a single high-density chip. Designed ...

DDN Unveils xFusionAI for Scalable AI Training and Inference
March 17th, 2025 Comments Off on DDN Unveils xFusionAI for Scalable AI Training and Inference
CHATSWORTH, Calif., March 17, 2025 -- DDN, a global leader in AI and data intelligence solutions, is unveiling xFusionAI, a new AI infrastructure that merges best-in-class training and inference performance into a single, highly optimized platform. Designed for next-generation agentic ...

Kore.ai Announces Agent Platform for Building, Deploying, and Orchestrating Agentic Applications
March 17th, 2025 Comments Off on Kore.ai Announces Agent Platform for Building, Deploying, and Orchestrating Agentic Applications
ORLANDO, Fla., March 17, 2025 -- Kore.ai, a global leader in enterprise AI, today announced the Kore.ai Agent Platform, an enterprise-grade multi-agent orchestration infrastructure for developing, deploying, and managing sophisticated agentic applications at scale. Building on a decade of proven ...

DDN Introduces IndustrySync for AI-Optimized Industry Workflows
March 17th, 2025 Comments Off on DDN Introduces IndustrySync for AI-Optimized Industry Workflows
CHATSWORTH, Calif., March 17, 2025 – DDN, a global leader in AI and data intelligence solutions, today introduced IndustrySync, a suite of AI solutions designed for Financial Services, Life Sciences, and Autonomous Driving. These AI stacks integrate DDN’s Infinia ...

CoolIT Debuts High-Capacity Row-Based Cooling Solution for AI and HPC
March 17th, 2025 Comments Off on CoolIT Debuts High-Capacity Row-Based Cooling Solution for AI and HPC
CALGARY, Alberta, March 17, 2025 -- CoolIT Systems has introduced the CHx1500, the world's highest-performing, most compact row-based coolant distribution unit (CDU). The CHx1500 sets the standard for CDU performance – providing 53% more cooling capacity and 26% greater ...

KIOXIA Announces High-Capacity LC9 Series 122.88 TB NVMe SSD for AI Applications
March 14th, 2025 Comments Off on KIOXIA Announces High-Capacity LC9 Series 122.88 TB NVMe SSD for AI Applications
SAN JOSE, Calif., March 14, 2025 -- KIOXIA America, Inc. has announced the development of its new LC9 Series 122.88 terabyte (TB) capacity NVMe SSD in a 2.5-inch form factor – the first SSD built with the company’s BiCS ...
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