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UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow
February 1st, 2023 (0)
HSINCHU, Taiwan and SAN JOSE, Calif., Feb. 1, 2023 -- United Microelectronics Corporation (UMC), a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been ...

Cybertrust Japan Integrates Private Keys from Quantinuum into New IoT Authentication Platform
January 31st, 2023 (0)
CAMBRIDGE, England and BROOMFIELD, Colo., Jan. 31, 2023 -- Quantinuum today announced that Cybertrust Japan Co., Ltd., Japan's leading certificate authority, has integrated its Quantum Origin quantum-computing-hardened private keys into a new certificate issuance and distribution platform for IoT ...

City Electrical Factors Selects HPE GreenLake to Modernize Its Customer and Data Experience
January 26th, 2023 (0)
LONDON, Jan. 26, 2023 -- Hewlett Packard Enterprise today announced that City Electrical Factors (CEF), the United Kingdom’s leading electrical wholesale network, has selected the HPE GreenLake edge-to-cloud platform as the first step in its digital transformation journey. The ...

Fujitsu and Samsung Partner with KDDI to Begin Commercial Deployment of 5G Open vRAN Sites in Japan
January 24th, 2023 (0)
TOKYO, Jan. 24, 2023 -- KDDI Corporation announced that, in cooperation with Samsung and Fujitsu, it initiated the commercial deployment of O-RAN compliant 5G Open Virtual Radio Access Network (hereinafter Open vRAN) sites in Osaka City, Osaka Prefecture, Japan, ...

OIF Marks 25th Anniversary, Launches New Physical and Link Layer Working Group Electrical Project 
January 23rd, 2023 (0)
FREMONT, Calif., Jan. 23, 2023 – OIF's first Technical and MA&E Committees Meeting of the year kicked off a year-long celebration of OIF’s 25th anniversary, the launch of an enhanced SGMII project – a Physical & Link Layer (PLL) ...

Tianjin Port Group and Huawei Annonce Plans to Build a Digital Twin of the Port
January 20th, 2023 (0)
TIANJIN, China, Jan. 20, 2023 -- Tianjin Port Group and Huawei announced this week that the two companies will deepen cooperation to build a digital twin of the port, making it more automated and intelligent. Yang Jiemin, Vice President ...

Vapor IO Expands Its Edge Computing Grid to Europe with Cellnex Partnership
January 12th, 2023 (0)
BARCELONA, Spain and AUSTIN, Texas, Jan. 12, 2023 -- Vapor IO, developers of the Kinetic Grid platform, the world’s first Open Grid network for delivering edge and grid services, has teamed up with Cellnex Telecom, a leading independent wireless telecommunications operator in Europe, ...

Lanner Introduces Next-Gen Network Security Appliances and Compute Blades Powered by 4th Gen Intel Xeon Scalable Processor
January 11th, 2023 (0)
TAIPEI, Taiwan, Jan. 11th, 2023 -- Lanner has announced the release of the NCA-6530, a 2U 19” rackmount network security appliance, and HMB-6130, a compute blade for Lanner HTCA-series. Both computing platforms support the dual-socket of 4th Gen Intel Xeon Scalable ...

University of Waterloo Leads Consortium to Develop Secure 5G Networks
January 11th, 2023 (0)
WATERLOO, Ontario, Jan. 11, 2023 -- The University of Waterloo today announced a 5G and beyond mobile network technology consortium funded by the Department of National Defence (DND) to improve Canada’s security and defence through its Innovation for Defence ...

Teledyne LeCroy Announces 800 Gigabit Ethernet, 8 Lane PAM4 Protocol Test Solution
January 11th, 2023 (0)
MILPITAS, Calif., Jan. 11, 2023 -- Teledyne LeCroy, a worldwide leader in protocol test and measurement solutions, has announced availability of the SierraNet M1288 Protocol Test Solution, which supports analysis of up to 8 lanes of IEEE 802.3ck based ...
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