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Redis Labs Raises $100M from Bain Capital Ventures and TCV
August 25th, 2020
MOUNTAIN VIEW, Calif., August 25, 2020—Redis Labs announced it has closed $100 million in Series F financing at a company valuation of more than $1 billion. This investment was co-led by Bain Capital Ventures and TCV, with participation by the company’s existing investors Francisco ...
Appen Partners with World Economic Forum to Create Responsible AI Standards
August 25th, 2020
SAN FRANCISCO, Aug. 25, 2020 -- Appen, provider of high-quality training data for machine learning systems, has partnered with the World Economic Forum to design and release standards and best practices for responsible training data when building machine learning ...
Synopsys Collaborates with TSMC to Accelerate 3nm Innovation, Enabling Next-Gen SoC Design
August 25th, 2020
MOUNTAIN VIEW, Calif., Aug. 25, 2020 — Synopsys, Inc. announced that TSMC has certified Synopsys’ digital and custom design platforms for TSMC’s 3-nanometer (nm) process technology. This certification, based on TSMC’s latest design rule manual (DRM) and process design kits (PDKs), is ...
AWS Announces General Availability of Amazon EBS io2 Volume
August 25th, 2020
SEATTLE, Aug. 25, 2020 — Amazon Web Services, Inc., (AWS), an Amazon Company, announced the general availability of io2, the next generation Provisioned IOPS SSD volumes for Amazon Elastic Block Store (Amazon EBS). The new io2 volume is designed ...
Ansys Achieves Certification of its Multiphysics Solutions for TSMC’s 3nm Process Technology
August 25th, 2020
PITTSBURGH, Aug. 25, 2020 — Ansys achieved certification of its state-of-the-art multiphysics signoff solution for TSMC’s most advanced 3nm process technology. This enables mutual customers to satisfy key power, thermal and reliability requirements for the world’s largest AI/ML, 5G, HPC, networking and autonomous ...
QCI Appoints Former Boeing Executive, James B. Davis, to Technical Advisory Board
August 25th, 2020
LEESBURG, Va., Aug. 25, 2020 — Quantum Computing Inc. has appointed former Boeing vice president and manufacturing operations expert, James B. Davis, to its technical advisory board. Davis brings to the board more than 30 years of experience in aerospace industrial ...
Synopsys and TSMC Accelerate 2.5D/3DIC Designs with CoWoS-S and Integrated Fan-Out Certified Design Flows
August 25th, 2020
MOUNTAIN VIEW, Calif., Aug. 25, 2020 — Synopsys, Inc. announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon interposer based Chip-on-Wafer-on-Substrate (CoWoS-S) and high-density wafer-level RDL-based Integrated Fan-Out (InFO-R) ...
Marvell and TSMC Collaborate to Deliver Data Infrastructure Portfolio on 5nm Technology
August 25th, 2020
SANTA CLARA, Calif., Aug. 25, 2020 – Marvell, provider of data infrastructure semiconductor solutions, announced an extension of their long term partnership with TSMC, a dedicated semiconductor foundry, to deliver a comprehensive silicon portfolio for the data infrastructure market ...
ScaleMP Expands its vSMP MemoryONE to Support Range of NVMe SSDs
August 25th, 2020
FORT LEE, N.J.–ScaleMP, provider of virtualization solutions for high-end computing, announced it is expanding its memory expansion product portfolio to offer vSMP MemoryONE software for a broad range of NVMe SSDs, available from ScaleMP and its authorized resellers. With this new ...
Intel Announces Latest Upgrades to its Intel oneAPI Rendering Toolkit at SIGGRAPH 2020
August 25th, 2020
Aug. 25, 2020 — At SIGGRAPH 2020, Intel announced the latest additions to the Intel oneAPI Rendering Toolkit. Part of Intel’s oneAPI family of products, the toolkit brings premier high-performance, high-fidelity capabilities to the graphics and rendering industry. The ...